Resilient Network Connectivity via Simultaneous Utilization of All Available Transmission Media // High Throughput Over-the-Top (OTT) Cluster-Based Wireless Service

Two talks presented by Dan Lofgren and Bill Brown

Tuesday, April 09
3:30 p.m. and 4:00 pm
ICSI Lecture Hall


3:30pm: Resilient Network Connectivity via Simultaneous Utilization of All Available Transmission Media

Dan Lofgren is Senior VP, Business Operations, TVU Networks Dan Lofgren’s career spans over 30 years in Silicon Valley high technology companies, first as a software engineer and engineering manager, then as a product manager. He’s worked for both software and hardware companies, in Internet services, telecommunications, e-commerce, and digital video, and has also consulted (as owner of Numerate Solutions) on quantitative marketing topics such as pricing and ROI. Dan was most recently VP of Product Management for TVU Networks. Dan spent four years as VP of Product Management at Open Harbor (web services for international trade facilitation); before that, he was Director of Product Management at, an e-commerce company. Dan has a B.S. in Applied Math from Yale.

4:00pm: High Throughput Over-the-Top (OTT) Cluster-Based Wireless Services

Abstract: Meeting the dual challenge of the FCC’s Tier 2 wireless service level objective of 25 mbps downlink and 3 mbps uplink and end-user demand for high resolution over-the-top content requires an innovative approach of allocation and managing spectrum resources. This presentation will describe an approach to providing remote and rural users within various terrestrial environments sustainable downlink rates. Descriptions of field trial deployments in the Southwest and Northeastern US will demonstrate how real-time spectrum management and monitoring can work to maximize spectrum reuse and minimize mutual interference.

Speaker: Bill Brown is the Founder and President of Metric Systems Corporation. He received his BSEE and MSEE from the University of Illinois, Champaign, IL. He has held staff positions at MIT Lincoln Laboratory and Raytheon Corporation.